Chinese foundry Cansemi Technology to build a joint R&D center for key materials of chip processes with Huangpu Institute of Materials

By Kate Yuan

Cansemi Technology (粤芯半导体), a Chinese 300mm foundry that in southern China’s Guangdong Province, signed an agreement with Huangpu Institute of Materials (黄埔材料院) to build a joint R&D center for key materials for IC manufacturing. The two parties staged a ceremony for the establishment of the center on April 26.

Source: Huangpu Institute of Materials

The joint R&D center will mainly undertake the research and development of key manufacturing process technology, testing and verification of key materials for IC manufacturing. In the future, the two parties will turn the center into a base for related services.

Yang Xiaoniu, head of Huangpu Institute of Materials, said that his Institute can provide its fruitful achievements in high purity chemicals, new material design and synthesis, and large-scale preparation technology. Combined with the solid industry foundation of Cansemi in chip manufacturing, the center is expected to complete the industry chain and reconstruct the industry ecology.

Guangdong-based Cansemi was founded in 2017, focusing on applications such as the Internet of Things, automotive electronics, industrial control, and 5G.

Huangpu Institute of Materials was established in 2020 as part of Guangdong-Hong Kong-Macao Greater Bay Area projects. It is an R&D institution for new materials co-organized by the Changchun Institute of Applied Chemistry, the Chinese Academy of Sciences, and Guangzhou High-tech Industrial Development Zone.